FuzionSC™ Platform Smart Equipment

FuzionSC™ is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range. Are high precision die and chip applications increasing your manufacturing costs while lowering your yields, resulting in decreased profits? Universal Instruments’ FuzionSC™ Platform offers a complete solution to flip chip package applications by blending the strict accuracy demands of Semiconductor assembly with the speed and robustness of Universal’s Fuzion Platform. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor-space. Datasheet — Silicon/SMT, high-accuracy/high-speed assembly; Dual- or single-beam, multiple-spindle heads; Full range of die and component types and sizes; Versatile substrate handling; Broadest range of feeding platforms; Low-maintenance, accurate over time; Vision robustness recognition of pins or

High accuracy

(±10µm, < 3µm placement repeatability)

Max Throughput (cph)

16,500, 8,400 (4-Bd IPC Chips) 30,750, 14,200 (4-Bd IPC Chips)

Accuracy (µm) at greater than 1.00 Cpk

±10 (Array Devices/Flip Chip), ±38 (Passives/Chips) ±10 (Array Devices/Flip Chip), ±38 (Passives/Chips)

Max Board Size

508 x 813mm 508 x 813mm

Max Feeder Inputs (8mm)

120 (2 ULC) 120 (2 ULC)