Flexbond Hot Bar Bonding Platform Smart Equipment

Flexbond ® leverages a highly parallel bond head architecture to deliver the first fully automated volume solution for advanced flex circuits and other hot bar interconnect applications. The Flexbond™ high-throughput hot bar bonding platform enables the first fully automated volume solution for advanced flex circuit and other hot bar interconnect applications. It combines with Universal Instruments’ Fuzion® Platform for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering. These configurable solutions have been shown to provide 6X to 12X the throughput of traditional semi-automated assembly stations and more than twice that of alternative automated hot bar solutions while reducing floor space requirements by 80%. They also require significantly fewer machines and offer the lowest OPEX and $/cph/m2. Datasheet — The first high-throughput automated hot bar bonding platform; Industry-best performance and a maximum bonding rate of 1800 UPH; Dual-z

Max Bonding Rate

1800 UPH

Carrier Size (W x D x H)

100 x 100mm (Min) to 500 x 350mm (Max)

Bond Head Configuration

Dual-zone: 3 or 6 heads per zone

Hot Bar Head Heating

High-fidelity pulse heat up to 600°C or constant heat up to 200°C

Upper-Board Heating

Constant heat up to 200°C